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The ability to divide a single processing cycle into as
many as 40 different time/temperature control segments allows precise
temperature profiling that will simulate the exact environment to which a PCB
assembly would be exposed in an in-line reflow system.
This level of control provides process
characterization that allows smooth transitions from prototyping and development
work to higher volume production.
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Reflow OvenÀ» ½ÇÇà ½Ã۸é Chamber ³»ºÎ heater ¿Âµµ¿¡ ´ëÇÑ Profile °ªÀÌ ½Ç½Ã°£
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Real-Time Temperature Monitoring and Data
Acquisition.
Real-time monitoring of the 200C temperature during the
process cycle
allows actual values to be compared to set values for precise
parameter adjustment.
The ability to save and print process data is also
ideal for training, development,
and even quality control
documentation.
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A Simple Solution for Your Low Volume
Lead-Free Reflow Needs
The 200C features a
front-load heating chamber with a sturdy pull-out drawer
and PCB holder for
assemblies up to 360 mm x 230 mm .
A tempered glass window allows the
user to view the reflow process.
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Àü¸é/»óÃøDoor°³Æó°¡ °¡´ÉÇϸç Å« ½Ã·á
ÀÛ¾÷µµ °¡´ÉÇÑ´Ù, °·ÂÇÑ Convection Fan 2°³°¡ Chamber ³»ºÎÀÇ ¿Âµµ ±â·ùÀ» °í¸£°Ô ¿Âµµ °ü¸®À» ÇÏ¿© ÁØ´Ù.
Infrared and Forced Convection Combine for Efficient
Pb Free Reflow.
Tubular quartz infrared heaters and an internal air
circulation system
provide a combination of IR and forced hot air convection
heating that is ideal for
fast, efficient, and uniform batch reflow soldering.
All system components are easily accessible for cleaning and
maintenance.
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Ź»ó¿ë(Bench-Top) Design Ideal for
Labs, ¿¬±¸¼Ò. QC. Çб³. ¼Ò·® »ý»ê¿¡ ÀûÇÕ.
Schools, Low-Volume Job Shops
The compact design and construction of the 200C
allows
bench-top operation in tight quarters where space is at a premium.
At a
weight of only 45 kg.
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