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[¸®Ç÷οì] 200 C<br>40 Step ¿ÂµµÁ¦¾î,PC Control
 HOME > Products > Reflow
Pb Free max 350'c / PC Interface and ´Ù±â´É Software ±âº»Á¦°ø
»óÇ°¸í [¸®Ç÷οì] 200 C
40 Step ¿ÂµµÁ¦¾î,PC Control
Á¦Á¶»ç Manncorp
+ 200 Series user manual eng_kr V13_S
+ 200 series software_ver-13_M
+ interface sw usb V13
+ 200 series sw V12_0
+ 200 Series Balance table
+
 

 

°æÁ¦ÀûÀÎ °¡°Ý´ë

 

¿Âµµ 40 Step Á¦¾î

 

PC¿¡¼­ ÇÁ·Î±×·¥ Àü¼Û ¹× 5°³ Memory

 

¿Âµµ Real Time Profile Display

 

 

 

 

 

200 C

 

¿Âµµ±¸°£¼³Á¤À»´ëÇü Reflow °ú°°ÀÌÃÖ´ë 40 ¿Âµµ±¸°£À»¼³Á¤°¡´ÉÇϸç, ÀÌ·¯ÇÑ ¸¹Àº

¿Âµµ StepÀ»ÅëÇÏ¿© SMD ºÎÇ°ÀÇ¿­·ÎÀÎÇѼջóÀ»±Ø¼ÒÈ­ÇÒ¼öÀÖ½À´Ï´Ù.

 

¡á     Àû¿ë¾÷ü : ¿¬±¸°³¹ß. QC. ¼Ò·® SMD Reflow °øÁ¤¹×»êÇבּâ°ü.

 

 

l Easy operation

PC Interface ȯ°æ¿¡¼­½±°íºü¸¥ÃÖ»óÀǿµµ Profile±¸ÇöÀÌ°¡´ÉÇϸç, PC¿¡¼­ ¹«ÇÑ

Program ParameterÀ»ÀúÀå/ Load ÇÒ¼öÀÖ½À´Ï´Ù.  ´©±¸³ª½±°Ô Reflow¿¡¼­Memory

¹øÁö¸¦ ¼±Åà ¡°RUN¡± KeyÀ»´©¸£¸éÀü.°øÁ¤ÀÚµ¿À¸·ÎÀÛ¾÷ÀÌÁøÇàµË´Ï´Ù. 

 

 

l  PC¾øÀÌ Program°¡´É

°¡Àå ¸¹ÀÌ»ç¿ëÇÏ´ÂÀÛ¾÷Àǿµµ ParameterÀ» PCB ȤÀº 200C¿¡¼­Parameter  Max 40 Step ±îÁö ¼³Á¤ ÈÄ, PC¿¡¼­ OvenÀ¸·Î ÇØ´ç Memory ¹øÁöÀ» ¼±Åà ÈÄ Àü¼ÛÇÑ´Ù,

  Reflow Oven¿¡¼­  5Á¾·ù<ÀúÀåµÈ ¹øÁöÀ» ¼±Åà ÈÄ Start KeyÀ» ´©¸£¸éReflow°¡ ÀÚµ¿ ÁøÇà µÈ´Ù.

 

 

l ¿Âµµ¼³Á¤±¸°£

¿Âµµ¼³Á¤Àº 1~40 Step(zone) ±¸°£À»¼³Á¤À¸·Îº¸´Ù°í.Ç°ÁúÀÇ Reflow ±¸ÇöÀÌ °¡´ÉÇϸç, ±¸°£º°  ¿Âµµ.½Ã°£À»¼³Á¤À» Full Menu¿¡¼­ºü¸£°Ô±¸Çö°¡´ÉÇÕ´Ï´Ù.

 

 

¿ÂµµProfiler

Reflow ÀÛ¾÷½Ã¿ÂµµÇÁ·ÎÈ­ÀÏ·¯ÀÌ¿ë½Ç½Ã°£ Chamber ³» Device¿Âµµº¯È­¸¦ GraphicÀ»ÅëÇÏ¿©º¼¼öÀÖÀ¸¸ç, ÃøÁ¤µÈ¿Âµµ¸¦ÀúÀåºÐ¼®ÇÒ¼öÀÖ½À´Ï´Ù.

 

 

 l N2 ±â´É ( 200NÇØ´ç )

ºÎÇ°¼ÒÀç°³¹ß¾÷üȤÀº°í¿Â Reflow¿¡¼­ SolderingÀ»¿äÇϴ¾÷ü¿¡¼­´Â  N2 »ç¿ëÀÌ ÇÊ¿ä·Î ÇÕ´Ï´Ù. N2ÀÇ PPM MeterÀ»ÅëÇÏ¿© Chamber ³»ÀÇ "O2" ÀÜÁ¸·®À» 500 ppmÀÌÇÏ°ü¸®ÇÒ¼öÀÖÀ¸¸ç,  À̶§ÀÇ Reflow door ±â´ÉÀÌ Loading & UnloadingÀÌÀÚµ¿ÀÛµ¿ µË´Ï´Ù.

 

 

Á÷±¸»çÀÌÆ®·Î À̵¿

 

 

 

PC¿¡¼­ ¿Âµµ/½Ã°£ ÃÖ´ë 40±¸°£À» ¼³Á¤ ÇÒ ¼ö ÀÖ´Ù. ¼ºÁ¤µÈ ¿Âµµ ParameterÀ»½Ã¹Ä·¡ÀÌ¼Ç ÇÏ¿© º¼ ¼ö ÀÖÀ¸¸ç, PC¿¡¼­ ¿Âµµ ParameterÀ» ÀúÀå °ü¸® ÇÒ ¼ö ÀÖ´Ù. ¶ÇÇÑ Oven¿¡ ÀúÀåµÈ Memory Parameter°ª ºÒ·¯ ¿Ã ¼ö ÀÖ´Â ¾ç ¹æÇâ Åë½Å ÇÁ·Î±×·¥ÀÌ´Ù

 

The ability to divide a single processing cycle into as many as 40 different time/temperature control segments allows precise temperature profiling that will simulate the exact environment to which a PCB assembly would be exposed in an in-line reflow system.

 


This level of control provides process characterization that allows smooth transitions from prototyping and development work to higher volume production.

 

 


Reflow OvenÀ» ½ÇÇà ½ÃÅ°¸é Chamber ³»ºÎ heater ¿Âµµ¿¡ ´ëÇÑ Profile °ªÀÌ ½Ç½Ã°£ GraphicÀ¸·Î ±¸ÇöÇÑ´Ù.

Real-Time Temperature Monitoring and Data Acquisition.

 

Real-time monitoring of the 200C temperature during the process cycle
allows actual values to be compared to set values for precise parameter adjustment.


The ability to save and print process data is also ideal for training, development,
and even quality control documentation.

A Simple Solution for Your Low Volume Lead-Free Reflow Needs

 

The 200C features a front-load heating chamber with a sturdy pull-out drawer
and PCB holder for assemblies up to 360 mm x 230 mm .
A tempered glass window allows the user to view the reflow process.

 

 


Àü¸é/»óÃøDoor°³Æó°¡ °¡´ÉÇϸç Å« ½Ã·á ÀÛ¾÷µµ °¡´ÉÇÑ´Ù, °­·ÂÇÑ Convection Fan 2°³°¡ Chamber ³»ºÎÀÇ ¿Âµµ ±â·ùÀ» °í¸£°Ô ¿Âµµ °ü¸®À» ÇÏ¿© ÁØ´Ù. Infrared and Forced Convection Combine for Efficient Pb Free Reflow.

Tubular quartz infrared heaters and an internal air circulation system
provide a combination of IR and forced hot air convection heating that is ideal for

 fast, efficient, and uniform batch reflow soldering.
All system components are easily accessible for cleaning and maintenance.

 

 


 Å¹»ó¿ë(Bench-Top) Design Ideal for Labs, ¿¬±¸¼Ò. QC. Çб³. ¼Ò·® »ý»ê¿¡ ÀûÇÕ.

Schools, Low-Volume Job Shops

 

The compact design and construction of the 200C
allows bench-top operation in tight quarters where space is at a premium.
At a weight of only 45 kg.

 

º» Àåºñ´Â Lab. Small SMD Assembly product °øÁ¤¿¡¼­ »ç¿ë ÀûÇÕÇϵµ·Ï °³¹ßµÈ

Ź»ó¿ë Reflow ÀÔ´Ï´Ù.

 

 

Àåºñ´Â 3°¡Áö À¯ÇüÀÌ ÀÖ½À´Ï´Ù.

200 A Basic ±â´É. ( 2012³â ÀÌÈÄ ÀáÁ¤ Áß´Ü)

200 C  PC ¿¬°á, ´Ù¾çÇÑ ±â´ÉÀÇ Software . Profiler ³»ÀåµÈ ±â´É (op).

l 200 N  N2 ȯ°æ + PC ¿î¿µ ȯ°æ¿¡¼­ »ç¿ëÇÒ ¼ö ÀÖ´Â Reflow.

 

 

º» Àåºñ´Â IR + Hot Air Convection TypeÀ¸·Î ¿Âµµ¸¦ ¹ß¿­Çϸç,

¿Âµµ StepÀ» ¿©·¯ ±¸°£À¸·Î ³ª´©¾î È°¿ëÇÒ ¼ö ÀÖ´Ù.

´ëÇü Reflow °°Àº ¿¹¿­ÀÇ ´Ü°èÀû Step, Welding¿¡¼­ ¿Âµµ ȯ°æ

¿ª½Ã »ç¿ëÀÚ°¡ ÀÚÀ¯·Ó°Ô ¿Âµµ.½Ã°£À» ¼³Á¤ ÇÒ ¼ö ÀÖ´Â °ÍÀÌ Æ¯Â¡ÀÌ´Ù.

 

 

Àû¿ëºÐ¾ß

 

¿¬±¸¼Ò. QC ½Å·Ú¼º

¼Ò·® »ý»ê¿ë.

Curning °øÁ¤.

Çб³. »êÇп¬¼¾Å¸

 

 

Âü°í : SMD Device ½Å·Ú¼ºÀ¸·Î »ç¿ëÇÏ´Â °ÍÀ¸·Î´Â ºÎÀûÇÕÇÏ´Ù.

      ÀÌ·¯ÇÑ ÀÌÀ¯´Â º» Àåºñ´Â IR heating TypeÀ̸ç, ´ëÇü Àåºñ´Â

Full Air Convection ¹æ½Ä (Hot AirÀ» Chamber°ø±Þ)ÀÌ´Ù

 

 

½Å·Ú¼º Àåºñ Ãßõ

 

301N Oven.

RK31, RK41, 551.15

    Àåºñ´Â Full Convection Reflow ÀÔ´Ï´Ù.

 

  • Àåºñ ±¸¼º Application