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[¸®Ç÷οì] 200N<br>N2. PC Interface.ÇÁ·ÎÆÄÀÏ·¯
 HOME > Products > Reflow > ¼ÒÇü ¸®Ç÷οì¼Ö´õ¸µ
N2. PC Interface, Pb Free Ź»ó¿ë Reflow, N2 ±Ø¼Ò¸ð µðÀÚÀÎ.
»óÇ°¸í [¸®Ç÷οì] 200N
N2. PC Interface.ÇÁ·ÎÆÄÀÏ·¯
Á¦Á¶»ç Manncorp
+ 200 Series user manual eng_kr V13_S
+ 200 Series Balance table
 


      200N

      º» Àåºñ´Â N2 + PC Interface ȯ°æ¿¡¼­ º¸´Ù ºü¸£°í , È¿À²ÀûÀ¸·Î Reflow À» »ç¿ë

      ÇÒ ¼ö ÀÖ´Â ±â´ÉÀÇ Å¹»ó¿ë Reflow ÀÔ´Ï´Ù.

 

      200C model ¿¡ ºñÇÏ¿© N2 ±â´É ¿Ü Door°¡ ÀÚµ¿À¸·Î loading / unloading  µÇ´Â

      ±â´ÉÀÌ ÀÖ´Ù.  N2 ¼Ò¸ð·®ÀÌ ¸Å¿ì Àû¾î °æÁ¦ÀûÀ¸·Î »ç¿ë µÉ ¼ö ÀÖ´Â N2 ReflowÀÌ´Ù.

 

       Pb Free ȯ°æ. Å¹»ó¿ë Reflow. Exhaust ±â´ÉÀ¸·Î ÀÛ¾÷Àå ³³ÅÆ ¿¬±â·Î ºÎÅÍ È¯°æ °³¼±.

      µÇ¾î ÀÛ¾÷ °ø°£ÀÇ À¯ÇØ GasÀ» ¿ÜºÎ·Î ¹èÃâ °¡´ÉÇÑ Port°¡ ±âº»À¸·Î ÀÖ½À´Ï´Ù.

 

      ´©±¸³ª »ç¿ëÀÌ Æí¸®ÇÑ ½±°Ô ¿î¿µÀÌ °¡´ÉÇÑ Software. ¼Ö´õ¸µ ½Ã, ½Ç½Ã°£ ¿Âµµ ¸ð´ÏÅ͸µ

      ÇÒ ¼ö ÀÖÀ¸¸ç, ¶ÇÇÑ Á¤¹ÐÇÑ ¿Âµµ ÇÁ·¯È­ÀÏÀ» ÅëÇÏ¿© ºÎÇ°ÀÇ Ç¥¸é ¿ÂµµÀ» °ü¸®ÇϹǷÎ

      ÃÖ»óÀÇ ¿Âµµ °ü¸®°¡ °¡´É ÇÑ Àåºñ ÀÔ´Ï´Ù. 

 

   l   ReflowÀÇ ±â¼úÀû »ó´ãÀ» ÇÊ¿äÇϽø頼º½ÉÀ» ´ÙÇÏ¿© ÇùÁ¶ µå¸®°Ú½À´Ï´Ù 

 

      Work Area :  270mm x 230mm

 

  • Energy-efficient, combination quartz infrared and forced hot-air convection
    heating with low turbulence air flow design
  • Inert gas supply inlet connection and integrated gas delivery system
    with built-in flow control for oxygen-free reflow processing
  • Serial communications interface and control software for recording, saving, printing real-time process data and parameter settings
    (Computer not included)
  • Unlimited storage/retrieval of precison solder profiles constructed
    of 20-40 user adjustable time/temperature segments
  • PID temperature controls for (+2µµ) accuracy;
    uniform (+1µµ) ¥ÄT across PCB surface
  • Viewing window allows visual inspection of reflow
  • Transverse flow cooling fans
  • Ideal for short runs, laboratoy testing, and training

 

 

       200C ¿Í °°Àº ±â´ÉÀ̸ç, N2±â´ÉÀÌ ÀÖ´Ù Door´Â ÀÚµ¿À¸·Î ÀÛµ¿µÈ´Ù.

       ÀÛ¾÷ ¿ëÀûÀ²Àº 200C º¸´Ù Á¶±Ý Àû´Ù.

 

¿Âµµ±¸°£ ¼³Á¤À» ´ëÇü Reflow °ú °°ÀÌ ÃÖ´ë 40¿Âµµ ±¸°£À» ¼³Á¤ °¡´ÉÇϸç, ÀÌ·¯ÇÑ ¸¹Àº

¿Âµµ StepÀ» ÅëÇÏ¿© SMD ºÎÇ°ÀÇ ¿­·Î ÀÎÇÑ ¼Õ»óÀ» ±Ø¼ÒÈ­ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

 

¡á    Àû¿ë¾÷ü : ºÎÇ°¿¬±¸.°³¹ß °í¿ÂReflow. QC. ¼Ò·® Reflow °øÁ¤ ¹× »êÇп¬ ±â°ü.

 

 

l Easy operation

PC Interface ȯ°æ¿¡¼­ ½±°í ºü¸¥ ÃÖ»óÀÇ ¿Âµµ Profile±¸ÇöÀÌ °¡´É Çϸç, PC¿¡¼­ ¹«ÇÑ

Program ParameterÀ» ÀúÀå/ Load ÇÒ ¼ö ÀÖ½À´Ï´Ù´©±¸³ª ½±°Ô Reflow¿¡¼­Memory

¹øÁö¸¦ ¼±Åà ¡°RUN¡± KeyÀ» ´©¸£¸é Àü.°øÁ¤ ÀÚµ¿À¸·Î ÀÛ¾÷ÀÌ ÁøÇà µË´Ï´Ù 

 

 

l PC ¾øÀÌ ÀÛ¾÷ °¡´É

°¡Àå ¸¹ÀÌ »ç¿ëÇÏ´Â ÀÛ¾÷ÀÇ ¿Âµµ ParameterÀ» Reflow¿¡  5Á¾·ù ÀúÀå ÈÄ PC¾øÀ̵µ

 Reflow »ç¿ëÀÌ °¡´É ÇÕ´Ï´Ù.

 

 

l ¿Âµµ¼³Á¤±¸°£

¿Âµµ ¼³Á¤Àº 1~40 Step(zone) ±¸°£À» ¼³Á¤À¸·Î º¸´Ù °í.Ç°ÁúÀÇ Reflow ±¸ÇöÀÌ °¡´É

Çϸç,±¸°£º°  ¿Âµµ.½Ã°£À» ¼³Á¤À» Full Menu¿¡¼­ ºü¸£°Ô ±¸Çö °¡´É ÇÕ´Ï´Ù.

 

 

l ¿ÂµµProfiler

Reflow ÀÛ¾÷ ½Ã ¿Âµµ ÇÁ·ÎÈ­ÀÏ·¯ ÀÌ¿ë ½Ç½Ã°£ Chamber ³» Device¿Âµµ º¯È­¸¦

GraphicÀ» ÅëÇÏ¿© º¼ ¼ö ÀÖÀ¸¸ç, ÃøÁ¤µÈ ¿Âµµ¸¦ ÀúÀå ºÐ¼® ÇÒ ¼ö ÀÖ½À´Ï´Ù.

 

 

 l N2 ±â´É

ºÎÇ°¼ÒÀç °³¹ß ¾÷ü ȤÀº °í¿Â Reflow¿¡¼­ SolderingÀ» ¿äÇÏ´Â ¾÷ü¿¡¼­´Â  N2 »ç¿ëÀÌ

ÇÊ¿ä·Î ÇÕ´Ï´Ù.   N2ÀÇ PPM MeterÀ» ÅëÇÏ¿© Chamber ³»ÀÇ "O2" ÀÜÁ¸·®À» 500 ppm

ÀÌÇÏ °ü¸® ÇÒ ¼ö ÀÖÀ¸¸ç,  À̶§ÀÇ Reflow door ±â´ÉÀÌ Loading & UnloadingÀÌ ÀÚµ¿

ÀÛµ¿ µË´Ï´Ù.



 

¿Âµµ/½Ã°£ Control Segments Allow Simulation of In-Line Reflow

 

The ability to divide a single processing cycle into as many as 40 different time
temperature control segments allows precise temperature profiling
that will simulate the exact environment to which a PCB assembly
would be exposed in an in-line reflow system.


This level of control provides process characterization
that allows smooth transitions from prototyping and development work to higher volume production.


              ½Ç½Ã°£ ¿Âµµ ÃøÁ¤ÀÌ °¡´ÉÇÑ  ¿Âµµ ÇÁ·ÎÈ­ÀÏ·¯,

            Temperature Monitoring and Data Acquisition

 

Real-time monitoring of the T200N temperature
during the process cycle allows actual values
to be compared to set values for precise parameter adjustment.
The ability to save and print process data is also ideal for training,
development, and even quality control documentation.

 

 

º» Àåºñ´Â Lab. Small SMD Assembly product°øÁ¤¿¡¼­

»ç¿ë ÀûÇÕÇϵµ·Ï °³¹ßµÈ Ź»ó¿ë Reflow ÀÌ´Ù.

 

Àåºñ´Â 3°¡Áö Ź»óÇü Reflow À¯ÇüÀÌ ÀÖ´Ù.

l   200 A  Basic ±â´É.

l  200 C   PC¿¬°á, ´Ù¾çÇÑ ±â´ÉÀÇ Software . Profiler ³»ÀåµÈ ±â´É (op).

l  200 N  N2 ȯ°æ + PC ¿î¿µ ȯ°æ¿¡¼­ »ç¿ëÇÒ ¼ö ÀÖ´Â Reflow.

 

º» Àåºñ´Â IR + Hot Air Convection TypeÀ¸·Î ¿Âµµ¸¦ ¹ß¿­Çϸç,

¿Âµµ/½Ã°£À»  1 ~ 40 Step ¿©·¯ ±¸°£À¸·Î ¼³Á¤ È°¿ëÇÒ ¼ö ÀÖ´Ù.

 

´ëÇü Reflow °°Àº ¿¹¿­ÀÇ ´Ü°èÀû Step, Welding¿¡¼­ ¿Âµµ ȯ°æ

¿ª½Ã »ç¿ëÀÚ°¡ ÀÚÀ¯·Ó°Ô ¿Âµµ.½Ã°£À» ¼³Á¤ ÇÒ ¼ö ÀÖ´Â °ÍÀÌ Æ¯Â¡ÀÌ´Ù.

 

 

 Àû¿ëºÐ¾ß

l  ¿¬±¸¼Ò. QC ½Å·Ú¼º

l  ¼Ò·® »ý»ê¿ë.

l  Curning °øÁ¤.

l  Çб³. »êÇп¬¼¾Å¸

 

Âü°í : SMD Device ½Å·Ú¼ºÀ¸·Î »ç¿ëÇÏ´Â °ÍÀ¸·Î´Â ºÎÀûÇÕÇÏ´Ù.

      ÀÌ·¯ÇÑ ÀÌÀ¯´Â º» Àåºñ´Â IR heating TypeÀ̸ç, ´ëÇü Àåºñ´Â

      Full Air Convection ¹æ½Ä (Hot AirÀ» Chamber°ø±Þ)ÀÌ´Ù

 

 

 

 ½Å·Ú¼º Àåºñ Ãßõ

l  Rp 6 Oven.

l  260. 548-04. 548-07. 548-10. 360

Àåºñ´Â Full Convection ÀÌ´Ù.