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301NÀº 301°ú µ¿ÀÏ ±â´ÉÀ̸ç N2»ç¿ë¿¡ µû¶ó Àåºñ ±â´ÉÀÌ Çâ»ó
»óǰ¸í [Reflow-¸®Ç÷οì]
301N(Áú¼Ò)
½Ç½Ã°£ ¿Âµµ Profiler
°¡°Ý N2 Reflow °¡Àå ¸¹ÀÌ ÆÇ¸ÅµÇ´Â Desk type
 

 

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301N Small Oven Àåºñ´Â  301 °ú °°Àº »ç¿ëȯ°æÀÇ ÀåºñÀÌ´Ù N2(Áú¼Ò)±â´ÉÀÌ Ãß°¡ µÇ¾ú´Ù. 301N

Àåºñ´Â Smart ȯ°æ¿¡¼­ reflow Soldering ¾÷¹«¸¦ º¼ ¼ö ÀÖ´Â Small reflow  Àåºñ ÀÔ´Ï´Ù.

 

301NÀº Áú¼Ò ȯ°æÀÇ reflow Àåºñ·Î 301 reflow Oven °ú µ¿ÀÏÇÑ ±â´É .µ¿ÀÏ function ÀÌ´Ù.

 

7' °íÇØ»óµµ LCD ÅÍÄ¡ ½ºÅ©¸°À» ÅëÇÏ¿© ½±°Ô ¿î¿µÀÌ °¡´É Çϵµ·Ï µÇ¾î ÀÖÀ¸¸ç wifi ȯ°æ¿¡¼­

internet ¸¦ ÅëÇÏ¿© Data Àü¼Û ¹× ÀúÀåÀÌ °¡´ÉÇÏ´Ù.

 

¼³Á¤µÈ °ªÀÇ ¿Âµµ¸¦ ½ÇÇàÀ» ½Ã۸é Real timeÀ¸·Î ¿Âµµ ProfileÀÌ ±¸ÇöµÇ¹Ç·Î  ¿¬±¸ °³¹ß. QC.

Çб³ ´Ù¾çÇÑ È¯°æ¿¡¼­ ´ëÇü Àåºñ ±¸Çö °ú °°ÀÌ »ç¿ë ÇÒ ¼ö ÀÖ´Â Smart Reflow Oven ÀÔ´Ï´Ù.

  

Android software ȯ°æ Software·Î ±¸¼º µÇ¾î ÀÖÀ¸¸ç, ±âº» Àåºñ WiFi ±â´ÉÀÌÆ÷ÇÔ µÇ¾î ÀÖ½À´Ï´Ù.

 

Chamber ¿Âµµ ±¸°£Àº ÃÖ´ë 100 Step ¿Âµµ ±¸ÇöÀÌ °¡´ÉÇϸç, º¸´Ù ½±°Ô ¿î¿µÀÌ °¡´ÉÇÑ È­¸é¿¡¼­

Preheating  Ramp   Reflow ±¸°£À» ¼³Á¤ ÇÒ ¼ö ÀÖÀ¸¸ç ±¸°£º°  Real Time¿Âµµ¸¦ È­¸é¿¡¼­ º¼ ¼ö ÀÖ´Ù.

 

±âº» ¿Âµµ ÇÁ·ÎÆÄÀÏ·¯°¡ Àåºñ ³» ÀåÄ¡µÇ¾î ÀÖ¾î ¼³Á¤¿Âµµ ¿Í ½ÇÀç ºÎǰÀÇ ¼Ö´õ¸µ ¿Âµµ¸¦ Çѹø¿¡

º¼ ¼ö ÀÖ´Â °ÍÀÌ Æ¯Â¡ÀÌ´Ù. 

 

ÃøÁ¤µÈ ¿Âµµ´Â º°µµ ÆÄÀÏ ÀúÀå °¡´É Çϸç, ¹Ù·Î  Email. SNSµîÀ¸·Î ¼ÛÃâ ÀúÀå. Ãâ·ÂÀÌ °¡´ÉÇÏ´Ù.

 

 

 

 301N  Reflow µ¿¿µ»ó 

 

 

 

 301N ( Áú¼Ò ) 

 

 

Multi Heating zone ±â´É  

 

Autotronik-SMT  301N Reflow´Â

Multi Heating °¡´É ÇÒ ¼ö ÀÖµµ·Ï Up Grade µÇ¾ú´Ù.

º» ±â´ÉÀº ReflowÀÇ Chamber ¼ö·®ÀÇ Zone °ú °°Àº ÀǹÌÀ̸ç

Heating ±¸°£ÀÌ ¸¹À¸¸é ¿Âµµ ±¸ÇöÀ» ´Ü°èÀûÀ¸·Î ¼¼ºÐÈ­ ¿Âµµ »ó½Â

º¯È­¸¦ ÁÙ¼ö ÀÖ¾î SMD ºÎǰÀÇ ¼Õ»óÀ» ±Ø¼ÒÈ­ ÇÒ ¼ö ÀÖÀ¸¸ç

´Ù¾çÇÑ ¿Âµµ ±¸ÇöÀÌ °¡´É ÇÒ ¼ö ÀÖ´Ù.

 

Á¾ÀüÀÇ Àåºñ´Â 4°³ ±¸°£ÀÇ ¿Âµµ ±¸ÇöÀ» ÇÏ¿´À¸¸ç, »õ·Î Ãâ½ÃµÇ´Â

Á¦Ç°Àº ÃÖ´ë 100 Step point  ¿Âµµ ±¸Çö º¯È­À» ÇÒ ¼ö ÀÖ´Ù.


ÀÌ·¯ÇÑ ¿Âµµ º¯È­´Â ½Å·Ú¼º ½ÃÇèµî¿¡ Àû¿ëÀÌ °¡´ÉÇϸç

ÃÊ(sec)´ÜÀ§ ¿Âµµ »ó½Â °³¼±ÇÏ¿© ¿øÇÏ´Â ¿Âµµ »ó½Â º¯È­°¡ °¡´ÉÇÏ´Ù.


 

Multi HeatingÀ» »ç¿ëÇϱâ À§ÇÏ¿© Run In Point¸¦ ¼±ÅÃÇÏ¿©¾ß ÇÑ´Ù.

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¿Âµµ ÇÁ·ÎÆÄÀÏ·¯ »ç¿ëÇϰíÀÚ ÇÒ ¶§ PCB Curve¸¦ ¼±ÅÃÇϸç.

Reflow ±¸°£ÀÌ ³¡ ³µÀ» ¶§ ÀÚµ¿ Cooling ±â´ÉÀÌ´Ù.


¸¸¾à ReworkÀ» ÅëÇÏ¿© ºÎǰÀ» Á¦°Å¸¦ ÇϰíÀÚ ÇÑ´Ù¸é Auto CoolingÀ» ÇØÁö ÇϸéµÈ´Ù.

 

 



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À̶§ LCD È­¸é¿¡ Real ¿Âµµ ProfileÀÌ ½Ç½Ã°£ Graphic Ç¥½ÃÇÏ¿© ÁØ´Ù.

 

 


 

Multi Heating ProgramÀ» ÇϰíÀÚ ÇÒ ¶§, Points ¼±ÅÃÇÑ´Ù.

 


 


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3¹øÀ» ´©¸£¸é 3°³ÀÇ Heating ±¸°£ÀÌ Çü¼ºµÈ´Ù.

¿øÇÏ´Â ±¸°£¿¡ ´ëÇÏ¿© ´©¸£¸é µÈ´Ù.

 


 

Point ¿¡¼­ ÇØ´ç Point¸¦ ¼±ÅÃÇÑ´Ù.

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¼³Á¤¿Âµµ / ¸Ó¹«´Â ½Ã°£ / ÃÊ´ç »ó½Â ¿Âµµ /´ÙÀ½ Point À̵¿ ½Ã°£.


 


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ÇØ´ç Step ±¸°£¿¡¼­ ¿Âµµ ¼³Á¤ 

 


 

ÇØ´ç Step ±¸°£¿¡¼­ Ãʴ砿µµ »ó½Â ¼³Á¤ .

 


 

 Point´Â ¿Âµµ Step ¼³Á¤À» ÀÇ¹Ì ÇÕ´Ï´Ù.

 


 

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ÆÄÀÏ ÀúÀå °ú ºÒ·¯¿À±â´Â »ó±â ÇÏ´Ü¿¡ ÀÖ´Ù.


 


½ÇÇàÇϰíÀÚ ÇÏ´Â ÇÁ·Î±×·¥À» ºÒ·¯ ³»¾î "Run"À» ½ÇÇàÇÏ¸é µÈ´Ù.

¶ÇÇÑ ÇÁ·Î±×·¥ ¼öÁ¤ ¿ª½Ã  ÆÄÀÏÀ» LaodÇÏ¿© Edit ÇÏ¿© ÁÖ¸é µÈ´Ù.


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data¸¦ Screen Capture¸¦ ÅëÇÏ¿© ÀúÀå ÇÒ ¼ö ÀÖÀ¸¸ç

Wiifi¸¦ ÅëÇÏ¿© Àü¼ÛÀÌ °¡´ÉÇÏ´Ù.


 

reflow ±¸°£¿¡ ´ëÇÑ ½Ã°£. ¿Âµµ º¯È­¸¦

ÀÚµ¿ ¿¬»êÇÏ¿© Ç¥½ÃÇÏ¿© ÁØ´Ù.


 

PID °ªÀº ÀÚµ¿ ¿¬»êÇÏ¿© ±¸°£º¯ º¯È­¸¦ ¾Ë·ÁÁØ´Ù. 

 

 

 Batch Reflow Oven w/ Android¢â Operating System

Match your solder paste manufacturers¡¯ precise specifications for preheat, soak, reflow,

and cooling with the 301 Batch Reflow Oven.

 

By simulating the conditions of an inline reflow system in a benchtop unit, the 301 is

ideal for product development, prototyping, and manufacturability testing.

 

Detailed solder profiles are easily programmed, stored, and downloaded through the

BT-301¡¯s exclusive hardware control app and Android operating system.

 

Android architecture also allows users to take advantage of touch screen operation and

integrated wireless networking for data transfer

  

 

n Android software platform and ultra-high-resolution touch screen display

n         Simulate profiles of inline ovens with preheat, soak, reflow, and cooling

n          Multi-channel PID zone temperature control for maximum temperature stability

n          Dual control modes - via heater thermocouples or built-in, on-board thermocouple

n           Front-loading heating chamber with working area of 250 x 200 mm

n           Built-in WiFi hardware supports seamless data transfer

  

 

   

 Features

 

           Programmable, controlled reflow, consistent with solder paste manufacturers' recommended

profiles, in a small bench top system.

 

Exclusive Android-based software drives heater control circuitry for precise, high-speed

temperature control Microprocessor-controlled, multi-channel PID zone temperature control

stabilizes temperature over 250 x 200 mm working area

 

Programming allows user-defined time and temperature settings for preheat, soak, reflow,

and cooling Unique on-board thermocouple feature allows temperature control via real-time

feedback from PCB surface Innovative Android architecture offers the advantages of touch

screen operation and integrated wireless networking

 

Nitrogen model available 301N (Áú¼Ò ±â´ÉÀÇ ¸ðµ¨)

 

  

 

 

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301NÀº Èĸé Flux ÇÊÅͱâ´É ÀÖ´Ù.

 

 

 

 

 

 

 

 

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