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M6900
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»óÇ°¸í M6900
 

"Model 6900"    Fully Automatic MCM/Flip Chip, Die Attach System
MCM, Silver Glass, Flip Chip ¶Ç´Â Combined Assembly µî ´ë·® »ý»ê¿¡ ÀûÇÕ.


±¸¼º : In-Line or Magazine to Magazine

Board »ç¿ë ¹üÀ§ : Silcon, Glass, BGA, Lead Frame, PCB µî

High Flexible machine with 2 Heads

Çѹø¿¡ 70°³ Waffle/ Gel packs ¶Ç´Â 40°³ Reel Feeder, 2°³ Wafers(8") ±îÁö ÀÛ¾÷°¡´É

Wafer Mapping ¶Ç´Â Ink Dot ÀνÄ

¸ðµç Á¾·ùÀÇ Flip chip ÀÛ¾÷ : Wafer, waffle/Gel Pack and Surf tape¿¡¼­ Die pick-up, Chip flipping, bump fluxing µî

Single/multi Dot ¹× Shape ÆÐÅÏ µð½ºÆæ½Ì (±âº» Dispense shape ¶óÀ̺귯¸®¿¡ ÀÌ¹Ì ÀúÀåµÊ)

Bond Line µÎ²² ÇÁ·Î±×·¥À¸·Î Á¤±³ÇÏ°Ô Á¶Àý°¡´É

ÍÔ-±â´ÉÀÇ Vision. ºÎÇ° ¹× Board¿¡ ´ëÇÑ ÆÐÅÏ ÀÎ½Ä ½Ã½ºÅÛ
ÃÖ¼Ò ºñ¿ëÀ¸·Î Multi-Chip Application °¡´É