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M.6495
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Die Chip P&P and BondingÀÛ¾÷ °¡´É. ÃÊÁ¤¹Ð ´Ù±â´É Àåºñ
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"Model 6496" for MCM/Hybrid, Silver Glass and Eutectic Die Attach System

´Ù¸ñÀû ¿ëµµÀÇ Desk-Top MachineÀ¸·Î 6495 ¸ðµ¨°ú ºñ½ÁÇÑ µðÀÚÀÎÀÌ´Ù. MCM/Hybrid/COB ¿Ü¿¡µµ Silver Glass, Eutectic(°øÀ¶), ÃÊÀ½ÆÄ ¾î¼Àºí¸®¿¡ ÀûÇÕÇÑ ÀåºñÀÌ´Ù. Bond Line µÎ²², ½ºÅ©·´ ÆĶó¹ÌÅÍ ¹× ÃÊÀ½ÆÄ ÆĶó¹ÌÅ͵éÀ» ¼ÒÇÁÆ®¿þ¾î·Î Á¦¾îÇÑ´Ù. Áß.¼Ò·® »ý»ê¿¡ ÀûÇÕ

2 or 4 Inch µÇ´Â Waffle ¶Ç´Â Gel-Pak ·ÎºÎÅÍ Pick-up

ÃÖ´ë 8 Inch wafer¿¡¼­ Pick-up (ÀÚµ¿/¼öµ¿)

Wafer Mapping ¶Ç´Â Ink Dot ÀνÄ

Eutectic(°øÀ¶), ºÒÈ°¼º °¡½º cover, °í¿Â °øÁ¤ Á¦¾î.

Board ³ôÀÌ ÃøÁ¤¿¡ ±âÃÊÇÑ °í-Á¤¹Ð Bond Line µÎ²² Á¦¾î.

Dispensing & Stamping (Pin transfer) : ¿¡Æø½Ã, UV adhesives, RTV's, Silver Glass µî

Library of Dispense Shapes (񃧯)


¢º 649X Applications


Eutectic on Lead Frames

MCM Flip chip

Silver Glass on PGA

Single Flip chip


SENSORS


MCM / Hybrids

< All Standard Substrates >

PCB

BGA

Ceramic

PGA's in Boat