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Vision Dispenser
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Á¦Á¶»ç Disepnser Lab
 

 

 

 

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TR 3500Àº 3Ãà Desk Top ·Îº¿ ½Ã½ºÅÛÀº °í¼º´É Linear Motor Á¦¾î ÀÛµ¿ ÇÕ´Ï´Ù. Linear Motor´Â °í¼Ó. °í Á¤¹Ð

ÀÛ¾÷¿¡ ÀûÇÕÇÑ Á¦¾î ±¸µ¿ ÀåÄ¡ ÀÔ´Ï´Ù. TR 350 RobotÀº ´Ù¾çÇÑ ÇÁ·Î¼¼½º ¸ðµâÀ» ÀÀ¿ë ÇÒ ¼ö ÀÖ½À´Ï´Ù.

 

n Jet Valve . Screw Valve. Pneumatic (°ø¾Ð) Valve. Laser Soldering Systemµî Àû¿ë

  

 TR 3500 ¸Å¿ì Á¤¹ÐÇÑ Á¦¾î Robot ÀÔ´Ï´Ù. ¹Ýº¹ Á¦¾î¿¡ ¿ÀÂ÷ 0.007mm À̸ç 1000mm / sec  Z Ãø 3050mmÀ̵¿ ¼Óµµ ¿Í linear Á¦¾î·Î Dot. line Arc ±¸Çö ´É·ÂÀ» °®°í ÀÖ½À´Ï´Ù.

Cad º¯È¯ data »ç¿ë °¡´ÉÇϸç, Vision  Çü»óÀÎ½Ä Camera¿¡ ÀÇÇÏ¿© ÀÛ¾÷¹°Ã¼¸¦ ÀÚµ¿ ÀνÄÇϰí ÀÚµ¿ ÁËÇ¥ ±³Á¤À» ÇÏ¿© ÁÝ´Ï´Ù. Laser º¯ÀÌ ¼¾¼­°¡ ÀÖ¾î FPCB. ÀÛ¾÷ÀÇ ³ôÀÌ ÃøÀÌ ºÒ±Ô°ÝÇÑ ÀÛ¾÷¹°À» ÀÚµ¿À¸·Î Height °ªÀ» ÃøÁ¤ ÇÑ ÈÄ , ÀÚµ¿ º¸Á¤ ÇÏ¿© ÁÝ´Ï´Ù.   ±×¿Ü °í°´ ÀÛ¾÷ Á¶°Ç¿¡ µû¶ó Application ÇÏ¿© µå¸³´Ï´Ù.

 

 

 

     Ư¡

  • ÀÚµ¿ ºñÁ¯ À§Ä¡. ÁÂÇ¥ ÀνÄ
  • ÇÇÆ¼¼Ç ¸¶Å© ÀÚµ¿ ÀÎ½Ä . ±³Á¤
  • ºñÁ¯ ÇÁ·Î±×·¥ ÀÛ¾÷ ȯ°æ
  • ´Ïµé ÀÚµ¿ ±³Á¤
  • ´Ïµé ÀÚµ¿ ±×¸®³Ê
  • ³ëÁñ ¿Âµµ Á¦¾î ÄÜÆ®·Ñ
  • µð½ºÆæ¼­ È¥ÇÕ ÀÛµ¿.
  • ¸ÖƼ ¸ðµÑ ÀÛ¾÷ ÇÁ·Î±×·¥
  •  Laser ¼Ö´õ¸µ (ÀÛ¾÷ ¿ë·®¿¡ µû¶ó Power odule ¼±ÅÃ)

 

 

 

 

 

     ´Ù¾çÇÑ ºÐ¾ß¿¡¼­ Àû¿ë »ç¿ë Áß

      ·Îº¿ Á¦¾î´Â 0.005mm ÀÌ¸ç ¹Ýº¹¿îµ¿ ¿ÀÂ÷À²Àº ¡¾0.01mm Á¦¾î, À̵¿¼Óµµ´Â 600mm/s 

 Mobile ºÎǰ. ÀüÀå. ¹æ»ê. ¿ìÁÖÇ×°ø. »ê¾÷±â±â ¼Ò·® ´ÙǰÁ¾ »ý»ê¿¡ Àû¿ëµÇ°í ÀÖÀ½.

 

 

 

 

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 ÇϳªÀÇ Àåºñ¿¡¼­ ¼Ö´õ µð½ºÆæ¼­ ÀÛ¾÷ + Laser Soldering °¡´É

 

 

 

Features

 

n  Linear motor technology. ¼±Çü ¸ðÅÍ ±â¼ú

n  Vision positioning. ºñÀü À§Ä¡Á¦¾î

n  Industry Computer . »ê¾÷¿ë ÄÄÇ»ÅÍ

n  Cross platform process software. ½ÊÀÚ Ç÷§Æû ÇÁ·Î¼¼½º ¼ÒÇÁÆ®¿þ¾î

n  High performance motion controller. °í¼º´É ¸ð¼Ç ÄÁÆ®·Ñ·¯

n  Humanized interaction. A.I »óÈ£ ÀÛ¿ë

n  Optional function module. ¼±ÅÃÀû ±â´É ¸ðµâ

 

 

 

 

Application

 

n   Solder Paste Jet Printing ¼Ö´õ ¸² ºÐ»ç ÇÁ¸°ÆÃ.  

n   Solder Paste Dispensing.  ¼Ö´õÅ©¸² ÅäÃâ.

n   Laser Soldering  ·¹ÀÌÀú ¼Ö´õ¸µ

n   Circuit board assembly.  È¸·Î º¸µå ¾î¼Àºí¸®

n   Hybrid circuit board assembly. ´Ù¾çÇÑ È¸·Î º¸µå ¾î¼Àºí¸®

n   Multi-variety production.  ´Ù ǰÁ¾ »ý»ê

n   Specified component assembly. ÁöÁ¤µÈ ±¸¼º ¿ä¼Ò ¾î¼Àºí¸®

n   3D stack packaging.     3D ½ºÅà Æ÷Àå

n   Circuit repaired works.   È¸·Î ¼ö¸® ÀÛ¾÷

n   MEMS packaging. MEMS ÆÐŰ¡

 

 

 

 

Software Ư¡

 

n  Vision automated positioning. ºñÀü ÀÚµ¿ Æ÷Áö¼Å´×

n  Mark point positioning. ¸¶Å© Æ÷ÀÎÆ® À§Ä¡ ÁöÁ¤   

n  Vision aided programming. ºñÀü Áö¿ø ÇÁ·Î±×·¡¹Ö

n  Nozzle teaching programming. ³ëÁñ ÇÁ·Î±×·¡¹Ö ÇÁ·Î±×·¡¹Ö

n  Template (modularized) programming. ÅÛÇø´ (¸ðµâÈ­) ÇÁ·Î±×·¡¹Ö

n  Mixed operation of dispensing. µð½ºÆæ½ºÀÇ È¥ÇÕ ÀÛµ¿

n  Laser soldering. ·¹ÀÌÀú ³³¶«

n  Laser Gauge for Height Compensation. ³ôÀÌ º¸»ó ¿ë ·¹ÀÌÀú °ÔÀÌÁö

n  Needle Calibration. ´Ïµé ±³Á¤

n  Nozzle Cleaner. ³ëÁñ Ŭ¸®³Ê

n  Nozzle Temperature Controller. ³ëÁñ ¿Âµµ ÄÁÆ®·Ñ·¯

n  Laser soldering auto-tune. ·¹ÀÌÀú ³³¶« ÀÚµ¿ Á¶Á¤

 

 

 

  2Á¾·ùÀÇ Robot 3000 Serve. 3500 Linear Á¦¾î

 Jet Valve & Screw valve  2Á¾·ù ±×¸®°í  Laser Soldering unit

ÀüÀå. Mobile ºÎǰ »ý»ê¿¡ ³Î¸® »ç¿ë Áß .

 

Solder Paste Dispensing ÈÄ Laser Soldering  °¡´É

½Å°³³äÀÇ Smart Çü»óÀÎ½Ä Vision System. Laser º¯ÀÌ ¼¾¼­

ÀÚµ¿ height °ª ÀÚµ¿ º¸Á¤

    

 

 

 

 Wire Soldering ¹®Á¦¸¦ ÇØ°áÇÑ Solder Paste

Dispensing À¸·Î  ºü¸¥ ÀÛ¾÷ °ú Á¤È®Çϰí ,´Ù¸¥ ºÎǰÀÇ ¿­ ¼Õ»ó ¾ø´Â Soldering ±¸Çö.  

 

 

 

 

  

 

 

 

  °íǰÁú Solder Dispenser ±¸ÇöÀ» À§ÇÏ¿© Solder Paste ¼±ÅÃÀ»

ÀÛ¾÷ À¯Çü¿¡ µû¶ó ¼±ÅÃÀ» ÇÏ¿©¾ß ÇÑ´Ù

 

   

 

  

 

 

 

 

 

 

 

 

 

 
  °íǰÁú Solder Dispenser ±¸ÇöÀ» À§ÇÏ¿© Solder Paste ¼±ÅÃÀ»

ÀÛ¾÷ À¯Çü¿¡ µû¶ó ¼±ÅÃÀ» ÇÏ¿©¾ß ÇÑ´Ù

 

 

 

´õºíŬ¸¯À» ÇϽøé À̹ÌÁö¸¦ ¼öÁ¤ÇÒ ¼ö ÀÖ½À´Ï´Ù

 

 

 

 

 

  

Dispenser Lab¿¡¼­´Â Solder Paste Á¤¹Ð ÅäÃâÀ» À§ÇÑ Solder Paste

°³¹ß ÆÇ¸Å¸¦ Çϰí ÀÖ½À´Ï´Ù, 

Àú¿Â. °í¿Â. ´Ù¾çÇÑ Æ¯¼ö Solder PasteÀ» °ø±ÞÇϰí ÀÖ½À´Ï´Ù.