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[¹ÝÀÚµ¿ °íÁ¤¹Ð ´ÙÀ̺»´õ] ND-10
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ND-10
°¡°Ý ÃÖ´ë 0.1*0.1mm
 

 

"ND-10" ¹ÝÀÚµ¿ °íÁ¤¹Ð ´ÙÀ̺»´õ - ÃÖ´ë 0.1 x 0.1 mm

ND-10 ¹ÝÀÚµ¿ ¸¶ÀÌÅ©·Î ´ÙÀ̺»´õ´Â ´ë¸®¼® µ¿ÀÛ Ç÷§ÆûÀ» »ç¿ëÇÏ¿© Àüü µ¿ÀÛ Á¤È®µµ°¡ ¹ÌÅ©·Ð ¹Ì¸¸ ¼öÁØ¿¡ µµ´ÞÇϵµ·Ï ÇÕ´Ï´Ù. ±íÀº °øµ¿ ±âÆÇ ÆÐÄ¡ ¹× °øÀ¶ ¿ëÁ¢ÀÇ ¿ä±¸ »çÇ×À» ÃæÁ·ÇÒ ¼ö ÀÖ´Â ·¹ÀÌÀú ³ôÀÌ ÃøÁ¤ ½Ã½ºÅÛ°ú ÇÔ²² Á¦°øµË´Ï´Ù.

 

 

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½Ã½ºÅÛÀÇ ½ÇÀå Á¤È®µµ´Â ´Ù¸¥ ±¸¼º¿¡ µû¶ó 1um¿¡ µµ´ÞÇÒ ¼ö ÀÖÀ¸¸ç, Ĩ Å©±â¿¡ µû¶ó ³ëÁñÀ» ¼öµ¿À¸·Î ±³Ã¼ÇÒ ¼ö ÀÖ½À´Ï´Ù. 

 

High-end ÀÇ·á±â±â(Core Imaging Module Assembly), ±¤Çбâ±â(Laser LD Palladium Bar Assembly, VCSEL, PD, LENS µî), ¹ÝµµÃ¼ Chip(MEMS Device, Radio ÁÖÆļö ÀåÄ¡, ¸¶ÀÌÅ©·ÎÆÄ ÀåÄ¡ ¹× ÇÏÀ̺긮µå ȸ·Î). ¿¬±¸ ±â°ü, ±º´ë, ´ëÇÐ ¹× ±âŸ ¿¬±¸ ±â°ü, ±â¾÷ ½ÇÇè½ÇÀÇ R&D ¹× ¼Ò·® ¹× ´ÙÇ°Á¾ »ý»ê ¿ä±¸¿¡ ¸Å¿ì ÀûÇÕÇÕ´Ï´Ù. 


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1. ½ÇÀå ½Ã½ºÅÛ
2. ½Ã°¢Àû º¸Á¤ ½Ã½ºÅÛ (ÀåÂøµÈ ĨÀÇ Á¤¹Ðµµ¸¦ ü°èÀûÀ¸·Î °Ë»ç ¹× ±³Á¤)
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5. °íÁ¤¹Ð ½Ã°¢Àû Á¤·Ä ½Ã½ºÅÛ
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Specification

Type ND-10 ND-10S
Max. chip size ¡Â20mm x20mm(50*50mm optional)
Min. chip size 0.2¡¿0.2mm 0.1¡¿0.1mm
Mounting precision ¡¾3um 3¥ä
Feeding mode 2 inch waffle box*2
Substrate size 150¡¿150mm 110¡¿110mm
Max. nozzle pressure Max. 200N, min. 2N Max. 200N, min. 0.2N
X Y Z axis motion system Roller screw + servo motor Roller screw + servo motor + grating ruler
X Y axis resolution 0.1um
Z-axis resolution 0.1um
R axis ¥è axis angle Rotation control accuracy: 0.01¡Æ
Air supply Industrial diaphragm pump
Power 3KW (not including eutectic table)
Power supply 220V, 50/60Hz
Net weight 150Kg 160Kg
Dimensions 800 * 750 * 630mm
Options

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