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M6400
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»óÇ°¸í M6400
 

"Model 6400"    Automatic High Accuracy Die Attach System
MCM, Flip chip, Eutectic, ÃÊÀ½ÆÄ ¾î¼Àºí¸®¸¦ À§ÇÑ Cold and Hot ÇÁ·Î¼¼½º ¼öÇà

(with Manual or automatic material load/unload)

High Placement Á¤È®µµ : 3§­ @ 3sigma (Æóȸ·Î ¼­º¸ ½Ã½ºÅÛ ¹× °íÇØ»óµµ Vision ½Ã½ºÅÛ)

ºÎÇ° Å©±â : 200§­ ~ 25mm

Pick-up from : 2" Waffle/Gelpack ÃÖ´ë 30°³ or 4" Waffle/Gel packs 쵀´ë 9°³
Pick-up from : ÃÖ´ë 300mm Wafer
Pick-up from : 8 x Tape and Reel feeder

´Ù¾çÇÑ ¸ð¾çÀ¸·Î ÇÁ·Î±×·¥ °¡´ÉÇÑ Volumetric dispensing.
½ºÅÆÇÎ Å©±â : ÃÖ¼Ò 75§­ Dot ±îÁö Stamping (pin transfer)

¸ðµç Á¾·ùÀÇ Flip chip ÀÛ¾÷ : Chip flipping, bump fluxing, Camera¿¡ ÀÇÇÑ Chip final alignment, Unique Die Stacking °¡´É

Ãë±Þ Device : CCD ¿Í ±âŸ ¼¾¼­, LCD, MEMs ¹× ´Ù¸¥ Sensitive devices