
"Model 6920" Full Auto MCM/Flip Chip, Silver Glass, Die Attach System
Active chip & wire and flip chip, Passive ºÎǰ µîÀÇ Multi chip ¸ðµâ ´ë·® »ý»ê¿ë.
±¸¼º : In-Line or Magazine to Magazine.
2°³ Head·Î µ¿½ÃÀÛ¾÷(Footprint ÀåÂø) °¡´ÉÇÏ¿© high FlexibleÇÑ °á°ú¸¦ ¾òÀ» ¼ö ÀÖ´Ù.
Çѹø¿¡ 70°³ Waffle/ Gel packs ¶Ç´Â 40°³ Reel Feeder, 10°³ Wafers(8") ±îÁö ÀÛ¾÷°¡´É
¸ðµç Á¾·ùÀÇ Flip chip ÀÛ¾÷ : Wafer, waffle/Gel Pack and Surf tape¿¡¼ Die pick-up °¡´É, Chip flipping, bump fluxing, Vision¿¡ ÀÇÇÑ ÍÔ-Á¤¹Ð alignment °¡´É
Single/multi Dot ¹× Shape ÆÐÅÏ µð½ºÆæ½Ì (±âº» Dispense shape ¶óÀ̺귯¸®¿¡ ÀÌ¹Ì ÀúÀåµÊ)
6900¸ðµ¨¿¡ ºñÇØ ±â´ÉÀÌ Çâ»óµÈ Vision ¾Ë°í¸®ÁòÀ¸·Î Board, active or passive ºÎǰ, Ink Dot °¨Áö µîÀÇ Á¤±³ÇÑ alignment°¡ °¡´ÉÇÏ´Ù.
Bond Line µÎ²² ÇÁ·Î±×·¥À¸·Î Á¤±³ÇÏ°Ô Á¶Àý°¡´É, ÇѹøÀÇ Pass·Î Die Stacking °¡´É
Heat°ú Scrubbing(ÇÁ·Î±×·¥ °¡´É) ¿¡ ±âÃÊÇÑ Eutectic(ÃÖÀú¿Âµµ¿¡¼ À¶ÇØ) |