"Model 6496" for MCM/Hybrid, Silver Glass and Eutectic Die Attach System
´Ù¸ñÀû ¿ëµµÀÇ Desk-Top MachineÀ¸·Î 6495 ¸ðµ¨°ú ºñ½ÁÇÑ µðÀÚÀÎÀÌ´Ù.
MCM/Hybrid/COB ¿Ü¿¡µµ Silver Glass, Eutectic(°øÀ¶), ÃÊÀ½ÆÄ ¾î¼Àºí¸®¿¡ ÀûÇÕÇÑ ÀåºñÀÌ´Ù.
Bond Line µÎ²², ½ºÅ©·´ ÆĶó¹ÌÅÍ ¹× ÃÊÀ½ÆÄ ÆĶó¹ÌÅ͵éÀ» ¼ÒÇÁÆ®¿þ¾î·Î Á¦¾îÇÑ´Ù. Áß.¼Ò·® »ý»ê¿¡ ÀûÇÕ
2 or 4 Inch µÇ´Â Waffle ¶Ç´Â Gel-Pak ·ÎºÎÅÍ Pick-up
ÃÖ´ë 8 Inch wafer¿¡¼ Pick-up (ÀÚµ¿/¼öµ¿)
Wafer Mapping ¶Ç´Â Ink Dot ÀνÄ
Eutectic(°øÀ¶), ºÒÈ°¼º °¡½º cover, °í¿Â °øÁ¤ Á¦¾î.
Board ³ôÀÌ ÃøÁ¤¿¡ ±âÃÊÇÑ °í-Á¤¹Ð Bond Line µÎ²² Á¦¾î.
Dispensing & Stamping (Pin transfer) : ¿¡Æø½Ã, UV adhesives, RTV's, Silver Glass µî
Library of Dispense Shapes (񃧯)
¢º 649X Applications
|
Eutectic on Lead Frames |
MCM Flip chip |
Silver Glass on PGA |
Single Flip chip |
SENSORS |
MCM / Hybrids |
< All Standard Substrates > |
PCB |
BGA |
Ceramic |
PGA's in Boat |
|